Packaging capacity is the amount of advanced assembly throughput available to turn bare chip dies into finished, high-performance components such as AI accelerators. This includes work like interposer bonding, stacking memory, attaching substrates, and final test. In modern AI systems, packaging is often as important as the silicon itself because multiple dies and memory stacks must be integrated before a chip can ship.
In cyber security, packaging capacity matters because it shapes the availability and trust of critical hardware. Tight capacity can delay secure infrastructure upgrades, concentrate production in a few facilities, and increase reliance on long supply chains. That creates opportunities for supply-chain tampering, counterfeit parts, and firmware or packaging-stage compromises. Defenders monitor vendor provenance, qualification records, and chain-of-custody controls to reduce these risks. For attackers, packaging bottlenecks are valuable because disrupting or subverting assembly can affect thousands of devices before they ever reach users.